The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Sep. 30, 1998
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device includes a lead frame including a die pad having corners, inner leads having respective inner end portions, outer leads, a hanging lead reinforcement, first hanging leads, and second hanging leads; a semiconductor chip bonded to the lead frame; and metal wires bonding the chip to the lead frame. A length of one side of the semiconductor chip is 2.5 mm smaller than a side of a molded resin external dimension, one side of the largest dimension of the hanging lead frame reinforcement not being longer than one side of the semiconductor chip. The die pad is sunk where second hanging leads are connected to the hanging lead reinforcement and has a step where connected to the second hanging leads. The camber of the external shape of the semiconductor device is reduced and a semiconductor device with high quality and reliability is obtained.