The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Jun. 01, 1999
Douglas H Weisman, Sunrise, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of forming high resolution circuit features on a substrate. A `seed` layer of copper (110) is deposited on a dielectric substrate (100). A dielectric layer (120) is then deposited on the copper layer, and an aluminum `mask` layer (130) is deposited on the dielectric layer. A photoresist layer (140) is spun on or laminated to the aluminum. The photoresist layer is imaged and developed to define a circuit pattern such that portions (230) of the aluminum `mask` layer are revealed, and these revealed portions are further etched so as to reveal portions (320) of the dielectric layer that are directly underneath. The remaining portions of the photoresist layer are stripped away, along with the revealed underlying portions of the dielectric film, exposing portions (410) of the copper layer in the image of the circuit pattern. The remaining portions of the aluminum mask are then removed, and the exposed copper is then electroplated to form the desired circuit traces (600). The remaining portions of the dielectric layer are stripped to expose the unplated portions of the copper layer, and these unplated portions are etched away with acid.