The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Dec. 02, 1997
Anthony J Cucinotta, Wakefield, MA (US);
Other;
Abstract
A reinforced laminate that is consists of conventional glass mesh, TEFLON mesh, etc. with copper clad to one or both sides and a positive or negative acting photoimageable dielectric material impregnated in the mesh. This photoimageable dielectric material is a substitute for conventional dielectrics like epoxy, polyimides, etc. This laminate construction will allow for via formation using established manufacturing methods for producing vias in printed circuits with minor process variations. This product will eliminate major process steps such as mechanical drilling, laser drilling and plasma etching. It will allow most printed circuit producers the capability of producing complex multilayer circuits that currently produced by relatively few circuit manufacturers. It eliminates processes such as plasma etching and laser processing and other capital-intensive methods that are currently in development or use. A further development as a result of this product allows for producing vias of any shape e.g. square holes, elliptical holes, slots, etc. It also results in certain designs for producing solid metal vias e.g. copper posts, which have higher conductivity and superior mechanical properties.