The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Oct. 01, 1997
Kengo Oka, Nukata-gun, JP;
Takashi Nagasaka, Anjo, JP;
Denso Corporation, Kariya, JP;
Abstract
A gold (Au) thick film land constituting a wire bonding electrode is formed by printing and sintering a gold (Au) thick film paste previously added with copper (Cu) to overlap with a copper (Cu) thick film which is formed as a wiring layer on a ceramic substrate. A semiconductor part mounted on the substrate and the gold (Au) thick film land are directly connected by a gold (Au) wire thereby electrically connecting the semiconductor part and the copper (Cu) thick film. In forming the gold (Au) thick film land, the gold (Au) thick film paste previously added with copper (Cu) is used. Therefore, disconnection caused by the Kirkendoll phenomenon is restrained and stable bonding between the copper (Cu) wiring layer and the gold (Au) thick film land can be achieved.