The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
May. 15, 1997
Frank J Baresich, Melbourne Beach, FL (US);
Thermal Wave Molding Corp., Aventura, FL (US);
Abstract
Mold cycle time is accelerated by employing thermally insulating surface temperature boosters, which are of a minimum thickness to promote cooling by heat transfer through the boosters. According to the thermal transfer properties of the insulating boosters and the respective temperatures of the molten material and the dies, the temperature of the cavity surface is raised by contact with the molten material to equal or exceed the temperature required to produce a molded article, preferably just until the time that the mold is fully filled. Heat transfer through the boosters to the dies then cools and solidifies the molded article until it can be removed from the mold. The temperature boosters result in increased cavity surface temperatures, such that the mold dies can be kept at substantially lower temperatures. The overall result is a reduction in mold cooling time and therefore acceleration of mold cycling.