The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Jun. 30, 1998
Hiroshi Honmou, Tokyo, JP;
NEC Corporation, , JP;
Abstract
It is an object of the invention to provide a optical semiconductor module, which is resisting against external noise and can be easily fabricated. The optical semiconductor module comprises an optical wave-guiding medium allocated on a substrate, a photosensor for optical to electrical converting the optical signal emitted from an output end of the optical wave-guiding medium, means for optically coupling the output end of the optical wave-guiding medium with a light-receiving surface of the photosensor, insulating resin for filling space surrounding an output part of the optical wave-guiding medium and the photosensor, and conductive resin, which is applied to the insulating resin and communicates with a ground plane connected with a ground terminal of the photo sensor. Insulting resin is composed of the first resin, which has a refractive index being the same as that of core of the optical wave-guiding medium, and fills a space between the output end of the wave-guiding medium and the light receiving surface of the photosensor, and the second resign, which is sealing resin for enclosing the first resin. Means for optically coupling is constituted of a mirror, which directs a light emitted from the optical wave-guiding medium to the photosensor.