The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2000

Filed:

Jun. 30, 1997
Applicant:
Inventors:

Hisaya Fukunaga, Kanagawa, JP;

Katsutoshi Kurogi, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F26B / ;
U.S. Cl.
CPC ...
34107 ; 432239 ;
Abstract

An air blow apparatus peels wafers off and simultaneously removes grease and grindstone grains by blowing air into gaps formed between semiconductor wafers sliced by a wire saw from a semiconductor ingot. Two injection nozzles 1a, 1b are symmetrically mounted at predetermined positions with respect to the central line c of the semiconductor wafer 10. Air injections 11a, 11b are injected from the outer top of the semiconductor wafer 10. Injection nozzles 1a, 1b are arranged so that they are movable in the longitudinal direction of the semiconductor ingot. Air injections 11a, 11b are set to be blown out at a cone shape of about 30 degrees.


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Fukunaga, Hisaya. (2000). Air blow apparatus for a semiconductor wafer (U.S. Patent No. 6018884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6018884

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