The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2000
Filed:
Sep. 16, 1998
David J Mountain, Baltimore, MD (US);
Abstract
A method of thinning a product wafer using equipment designed for a wafer diameter, where the diameter of the product wafer is smaller than the wafer diameter of the thinning equipment by cutting an opening in a template wafer, where the template wafer is of a diameter that may be thinned by the thinning equipment, and where the opening accommodates the product wafer; affixing the template wafer to a holding material; affixing the product wafer to the holding material and inside of the template wafer with the integrated circuit side up; depositing an etch stop onto a handle wafer, where the handle wafer is at least as large as the template wafer; bonding adhesively the product wafer to the etch stop; removing the holding material; filling any gaps between the product wafer and the template wafer; using wax to make the product wafer sufficiently planar; thinning the product wafer using the thinning equipment; removing any excess wax; bonding adhesively the product wafer to a transfer wafer, where the transfer wafer is at least as large as the template wafer; removing the handle wafer; removing the etch stop; and removing any adhesive that remains on the product wafer.