The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2000
Filed:
Feb. 23, 1998
Applicant:
Inventors:
Tsutomu Shibuya, Hadano, JP;
Kaoru Katayama, Hadano, JP;
Mitugu Shirai, Hadano, JP;
Shinichi Kazui, Hadano, JP;
Hideaki Sasaki, Hadano, JP;
Yasuhiro Iwata, Hadano, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07C / ; C07C / ; C07C / ; C07C / ; C07C / ;
U.S. Cl.
CPC ...
20415715 ;
Abstract
A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.