The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2000
Filed:
Oct. 29, 1997
Applicant:
Inventor:
Hideaki Uemura, Kanagawa, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257666 ; 257670 ; 257676 ;
Abstract
In a semiconductor device, a lead frame includes normal leads terminating before an edge of a semiconductor chip and LOC leads extending over the semiconductor chip. The semiconductor chip is fixed to the lead frame by adhering the semiconductor chip to stitch sections of the LOC leads through an adhesive tape. A power supply pin and a ground pin are formed of LOC leads having a plurality of stitch sections, which are connected to a plurality of corresponding bonding pads, respectively, through bonding wires. On the other hand, signal pins are formed of normal leads which are connected to corresponding bonding pads through bonding wires, respectively.