The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2000
Filed:
Jun. 10, 1998
Floyd K Eide, Huntington Beach, CA (US);
Irvine Sensors Corporation, Costa Mesa, CA (US);
Abstract
A structure and process are disclosed in which IC chip-containing layers are stacked to create electronic density. Each layer is fabricated by forming one or more flexible circuit around a TSOP. Each flexible circuit contains conductors which are disposed to connect with TSOP leads, transpose signals to or from various locations on the top or bottom of the TSOP, and/or terminate in ball grid contacts for connection to other layers in the stack. The flexible circuit is bonded to the TSOP such that ball grid contacts are exposed on the top and bottom of the TSOP, and the ball grid array contacts on the bottom of the lowest layer are disposed to facilitate connection with a PCB or other circuitry.