The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2000
Filed:
May. 15, 1998
Kazuyuki Mikubo, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor package structure comprising the following elements. A printed board has a first surface on which a plurality of first heat-conductive patterns are provided and a second surface on which a plurality of second heat-conductive patterns are provided. The printed board has heat-conductive through holes connecting the first and second heat-conductive patterns. A multi-chip module has a plurality of semiconductor packages and is provided on the first surface of the printed board. A plurality of heat-conductive supporting members are provided on the first heat-conductive patterns. A heat radiator structure is provided which has at least two heat radiation fins and at least a heat radiation groove defined by the heat radiation fins. The heat radiator structure is provided on the multi-chip module. A plurality of heat conductivity plate-shaped members are fixed to the heat-conductive supporting members and inserted into the heat radiation groove so that the heat conductivity plate-shaped members are in contact with upper surfaces of the heat radiation fins. A first heat transfer route is formed for transferring a heat generated in the multi-chip module through the heat radiator structure to atmosphere surrounding the heat radiator structure. A second heat transfer route is formed for transferring the heat through the heat radiator structure, the heat conductivity plate-shaped members, the heat-conductive supporting members and the first heat-conductive patterns to the printed board and also to the through holes which are heat-conductive to the second heat-conductive patterns. A third heat transfer route is formed for transferring the heat to the printed board.