The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2000
Filed:
Jun. 16, 1997
Michelle J Morrell, Glen Ellyn, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A microelectronic assembly (10) is formed and includes an integrated circuit component (12) attached to a substrate (14). The integrated circuit component (12) includes metallic columns (24) formed on bond pads (16) on the component (12). A solder plate (30) is formed on each of the metallic columns (24). The integrated circuit component (12) is superposed onto a substrate (14). The substrate (14) includes substrate bond pads (32), and each metallic column (24) registers with a corresponding substrate bond pad (32) such that the solder plate (30) contacts the substrate bond pad (32) to form a preassembly. The preassembly is then heated to reflow the solder plate (30) to form a solder joint (34) between the integrated circuit component (12) and the substrate (14). The solder joint (34) is formed between the solder attachment surface (28) of the metallic column (24) and the substrate bond pad (32).