Device for introducing a vacuum to the vacuum chuck of a semiconductor

Abstract

A vacuum transfer device for engaging a vacuum chuck to introduce a vacuum thereto includes an upper fixed plate fixed, a lower plate slidingly coupled with the upper plate so as to be capable of sliding toward and away from the vacuum chuck, and a pushing unit mounted to the upper plate for forcing the lower plate into position against the vacuum chuck. The pushing unit has a lever urged by a coil spring to press a roller into engagement with a curved surface of the lower plate, and gap control elements by which the position of the roller relative to the inclined surface can be adjusted to in turn adjust the force exerted by the roller on the lower plate. The gap control elements along with the curved surface of the lower plate make it quite easy to set the precise force by which the roller positions the lower plate of the device against the vacuum chuck. This in turn prevents the chuck and vacuum transfer device from being damaged, minimizes the time the facility must be down while the pushing unit is being adjusted, and works to ensure that no gap will be left between the vacuum transfer device and the vacuum chuck.