The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2000

Filed:

Jun. 04, 1997
Applicant:
Inventors:

Richard K Thornburg, Loveland, CO (US);

Timothy A Lock, Fort Collins, CO (US);

Assignee:

Hewlett Packard Co., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361695 ; 165 803 ; 361796 ; 454184 ;
Abstract

A compact apparatus for cooling circuit packs disposed in a supporting cage, while providing a substantially uniform flow of coolant at enhanced volume and static pressure, and while reducing ambient noise level. The invention includes a circuit pack cage having a plurality of parallel longitudinal slots for receiving the circuit packs and for arranging the circuit packs in parallel with one another. A plenum of the invention has a plurality of parallel longitudinal troughs, wherein each trough has a respective elongated opening extending along a longitudinal dimension of the trough. The elongated openings of the troughs are arranged for proximate fluid coupling along the longitudinal dimension of each of the circuit packs adjacent to the surfaces of the circuit packs, Each trough of the plenum has a respective extremity opening, which provides for coupling with an impeller. The impeller is arranged in fluid communication with the extremity openings of the troughs, so as to provide a cooling gas flow through the troughs and over the heat generating electronic components affixed to the surfaces of the circuit packs.


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