The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2000

Filed:

May. 27, 1998
Applicant:
Inventor:

Hideharu Nakajima, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451287 ; 451527 ;
Abstract

Disclosed is a chemical-mechanical polishing apparatus having a polishing cloth enabling planarization in which occurrence of mictoscracthes is suppressed without the need of provision of a dressing step. The apparatus basically includes a turn table on which a polishing cloth is mounted, a holding base for holding a substrate to be processed, and a polishing solution supply unit. The surface of the polishing cloth has irregularities formed by arranging a large number of truncated cone-shaped small holes in a delta-shaped pattern at specific intervals. The depth of the small holes is set at about 800 .mu.m and the interval is set at about 300 .mu.m. Such an apparatus is effective to improve the yield in fabrication of highly integrated semiconductor devices using the apparatus at a planarization step.


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