The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1999
Filed:
Sep. 17, 1998
Advanced Ceramic X Corp., Taipei, TW;
Abstract
The present invention provides a new packaging form of a semiconductor diode, which is fabricated by using low-temperature cofired ceramic (LTCC) technology. The fabrication method is low-cost and the resulting chip form semiconductor diode has good hermeticity and high reliability. The fabrication method includes the steps of: (a) providing a ceramic green tape having a through hole for positioning a diode die; (b) positioning a diode die in the through hole; (c) sandwiching the diode die between two ceramic green tapes having printed conductive layers facing the electrode surfaces of the diode die; (d) laminating the ceramic tapes into a compact such that the conductive layers connect to the electrodes of the diode die; (e) firing the laminated parts to form a monolithic sintered body; and (f) forming end terminals, and solder-plating the end terminals to finish a ceramic chip of the semiconductor diode.