Method for applying heat bondable lamina to a substrate

Abstract

Apparatus and method suitable for making a plurality of laminated substrates by applying a plurality of laminate sheets to corresponding plurality of substrates. The apparatus includes a lamina supply member capable of holding a supply of lamina from which successive sheets of lamina can be cut. A cutter is disposed in the apparatus such that the cutter is capable of cutting through the lamina to provide said successive sheets of laminate. A heater is provided for bonding each successive sheet of laminate to a corresponding substrate whereby the corresponding laminated substrate is formed. The supply of lamina is characterized by a current leading edge. The supply of lamina is cut through along a cutting line at a predetermined distance from the current leading edge of the lamina. This provides a first sheet of laminate having a trailing edge at the cutting line. Cutting also provides the lamina supply with a successive leading edge at the cutting line. There is substantially no wasted lamina material between the trailing edge of the laminate sheet and the successive leading edge of the lamina. The laminate sheet is then bonded to a corresponding substrate. The steps of cutting the lamina along a cutting line and bonding the resultant lamina sheet to a corresponding substrate are repeated a plurality of times to yield the plurality of laminated substrates.