The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 1999

Filed:

Aug. 20, 1997
Applicant:
Inventors:

Denise R Rutherford, Stillwater, MN (US);

Douglas P Goetz, St. Paul, MN (US);

Cristina U Thomas, Woodbury, MN (US);

Richard J Webb, Inver Grove Heights, MN (US);

Wesley J Bruxvoort, Woodbury, MN (US);

James D Buhler, Shringle Springs, CA (US);

William J Hollywood, San Carlos, CA (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451552 ; 451553 ; 451534 ;
Abstract

An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.


Find Patent Forward Citations

Rutherford, Denise. (1999). Abrasive construction for semiconductor wafer modification (U.S. Patent No. 6007407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6007407

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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