The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1999
Filed:
Jun. 16, 1998
Robert L Zak, St. Paul, MN (US);
Honeywell Inc., Minneapolis, MN (US);
Abstract
In a process for fabricating a printed circuit board assembly carrying a chip on board type microcircuit package, aluminum wires are bonded to the aluminum pads on the microcircuit and to bare copper connector pads on the printed circuit board to form the electrical connection between them. The microcircuit, aluminum wires, and copper connection pads are then encapsulated with a material such as low stress liquid encapsulant having a thermal expansion coefficient approximately equal to that of the printed circuit board substrate material. Preferably the process includes steps of mounting the microcircuit and forming the copper connector pads on a printed circuit board laminate comprising cellulose epoxy mat such as CEM-1.