The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 1999
Filed:
Sep. 23, 1998
John W Cassen, Sykesville, MD (US);
Gary N Bonadies, Laurel, MD (US);
Patrick K Richard, Baltimore, MD (US);
David A Herlihy, Ellicott City, MD (US);
Ayn U Fuller, Greenbelt, MD (US);
Daniel H Wenzlick, Linthicum, MD (US);
Richard C Kapraun, Baltimore, MD (US);
Mark R Schrote, Ellicott City, MD (US);
Kerry M Yon, Beltsville, MD (US);
H Halley Lisle, IV, Monrovia, MD (US);
Toby Hess, Olney, MD (US);
Edward L Rich, III, Arnold, MD (US);
George T Hall, Catonsville, MD (US);
Brian T Drude, Arbutus, MD (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.