The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 1999

Filed:

Nov. 04, 1996
Applicant:
Inventors:

Yuiti Kaiya, Yamagata, JP;

Takehiko Takahashi, Yamagata, JP;

Takemitu Sato, Yamagata, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257674 ; 257666 ; 257667 ; 257668 ; 257673 ; 257734 ; 257798 ;
Abstract

A semiconductor device in which a flat inner lead is connected to a semiconductor pellet so that a side edge of the inner lead is connected to the semiconductor pellet. The lead includes a constricted portion that is twisted so that the side edge faces a surface of the pellet to which the lead is connected. A lead frame is arranged so that the side edge can be twisted into position.


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