The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 1999

Filed:

Oct. 03, 1996
Applicant:
Inventors:

Holger Reinecke, Rulzheim, DE;

Friedolin Franz Noker, Karlsruhe, DE;

Assignee:

Microparts Gesellschaft, Dortmund, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427581 ; 427123 ; 427404 ;
Abstract

Patterned dies made of non-conductive resins may be equipped with integrated electrodes in different manners. It is proved to be difficult to produce high-quality electrodes especially in microstructured dies. A patterned plastic die arranged on a carrier plate is filled with a solution of a metal compound. This solution is irradiated through the carrier plate from the back side of the carrier plate using laser light, ultraviolet light or X-rays. The metal compound is transformed in the immediate vicinity of the base of the structure and a metal layer is deposited on the base of the structure forming the electrodes. The method is suitable for a base of the structure forming a coherent or a non-coherent area. Plastic dies containing integrated electrodes are used for electroless or electrophoretic deposition of materials and for electroplating, in all cases starting from the integrated electrodes, and for analytical methods.


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