The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Sep. 10, 1996
Applicant:
Inventors:

Gregory L Ranson, Fort Collins, CO (US);

John W Bockhaus, Fort Collins, CO (US);

Gregg B Lesartre, Fort Collins, CO (US);

Patrick Knebel, Fort Collins, CO (US);

Paul L Perez, Fort Collins, CO (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; G06F / ; H01L / ;
U.S. Cl.
CPC ...
710131 ; 326 41 ; 326101 ;
Abstract

Circuitry for providing external access to signals that are internal to an integrated circuit chip package. A plurality of N:1 multiplexers are physically distributed throughout the integrated circuit die. Each of the multiplexers has its N inputs coupled to a nearby set of N nodes within the integrated circuit, and each of the multiplexers is coupled to a source of select information operable to select one node from the set of N nodes for external access. Each of the multiplexers has its output coupled to an externally-accessible chip pad. The integrated circuit is a microprocessor, and the source of select information may include a storage element. If so, additional circuitry is provided for writing data from a register of the microprocessor to the storage element using one or more microprocessor instructions. Each multiplexer may be coupled to a different source of select information, or all multiplexers may be coupled to the same select information. Moreover, a fixed set of interconnect traces may be provided to couple a fixed set of nodes to an additional set of externally-accessible chip pads. One or more M:1 multiplexers may also be provided, having their M inputs coupled to M different outputs of the N:1 multiplexers. Each of the M:1 multiplexers may be coupled to a second source of select information. Preferably, the outputs of the M:1 multiplexers will be coupled to a circuitry for facilitating debug and performance monitoring of the integrated circuit.


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