The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1999
Filed:
Dec. 08, 1997
Sony Corporation, Tokyo, JP;
Abstract
An semiconductor device and a method for manufacturing semiconductor devices which are easily made compact. A plurality of semiconductor chips having protrusion electrodes respectively provided on a plurality of electrodes formed on circuit surfaces are integrally sealed by an insulating material so as to cover the circuit surfaces while the circuit surfaces are nearly directed to the same direction and arranged in prescribed conditions, and to expose the respective protrusion electrodes; and insulating layers and wiring layers respectively electrically connected to the corresponding protrusion electrodes are alternately laminated on the insulating material so as to have the desired number of layers in the direction of thickness. Thus, the spaces between the semiconductor chips can be extremely narrowed, and the thickness of the insulating layers and wiring layers can be significantly reduced, so that the semiconductor devices which can be made compact without difficulty and the method capable of easily manufacturing the semiconductor devices in compact forms can be realized.