The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1999
Filed:
Dec. 21, 1992
Applicant:
Inventors:
Paolo Casati, Sesto San Giovanni-Milano, IT;
Pierangelo Magni, Villasanta, IT;
Giuseppe Marchisi, Milan, IT;
Assignee:
SGS-Thomson Microelectronics S.r.l., Agrate Brianza, IT;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257739 ; 257796 ; 257706 ;
Abstract
A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).