The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Mar. 11, 1998
Applicant:
Inventors:

Sei Ishizawa, Moriyama, JP;

Masayasu Suzuki, Yasu-gun, JP;

Hirokazu Terada, Moriyama, JP;

Assignee:

Chisso Corporation, Osaka-fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D02G / ;
U.S. Cl.
CPC ...
442632 ; 442364 ;
Abstract

Melt-adhesive composite fibers; non-woven fabrics from the composite fibers fused at intersectional points of the fibers; and surface materials for medical supplies such as sanitary napkins and paper diapers are disclosed. The composite fibers have a polypropylene as the first component and a polymer mainly composed of a polyethylene as the second component which is continuously present on at least a part of the fiber surface in the lengthwise direction of the fiber; have three-dimensional crimps of 4 to 16/inch; have a filamentary denier of 1.0 to 2.0, and have an apparent cut length of 20 to 40 mm. The composite fibers can be produced by extruding a polypropylene and a polymer mainly comprising a polyethylene through a spinneret for composite spinning to form unstretched composite filaments having such structure as mentioned above, stretching the unstretched composite filaments at a temperature of higher than 90.degree. C., but lower than 130.degree. C. at a stretching ratio of 0.60 to 0.85 time the maximum stretching ratio, cooling the stretched filaments to a temperature lower than a preheating temperature, subjecting the filaments to a crimping treatment, and subjecting the filaments to an annealing at a temperature of higher than 80.degree. C., but lower than 120.degree. C.


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