The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Sep. 18, 1997
Applicant:
Inventors:

Shinji Nunotani, Yokohama, JP;

Hiroshi Uchida, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427240 ; 427154 ; 427156 ;
Abstract

A resist coating method includes the steps of dripping solvent onto a wafer and rotating the wafer, and then dripping resist onto the wafer and rotating the wafer. Since resist can be dispensed without waste, the total amount of resist used can be reduced. A resist coating apparatus has a wafer support for rotating a wafer placed thereupon, a first nozzle for dripping solvent onto the wafer, a second nozzle for dripping solvent onto the wafer, and a controller for controlling the dripping of resist onto the wafer after solvent has been dripped. By employing this apparatus, the total amount of resist used can thereby be reduced. Furthermore, the total amount of resist used can be further reduced by further providing a temperature controller for lowering the resist temperature to 1-5.degree. C. below room temperature.


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