The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Jan. 28, 1998
Applicant:
Inventor:

Nariaki Fujiwara, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ; B24C / ; H01L / ;
U.S. Cl.
CPC ...
451-6 ; 451-5 ; 451-8 ; 451 36 ; 451286 ; 451287 ; 438974 ; 216 85 ; 216 88 ; 156640 ;
Abstract

A grinding process monitoring system and grinding process monitoring method for monitoring progress of a grinding process by measuring thickness of a film applied to a substrate surface and undergoing the grinding process. A spectrum measuring device for measuring a spectrum of light reflected from the substrate surface has a measuring window opposed to the substrate surface. A measurement region between the measuring window and the substrate surface is filled with a cleaning liquid to form a liquid curtain in the measurement region. While examining bubble characteristic variations occurring in the spectrum due to bubbles present in the measurement region, a moving device is controlled to adjust a spacing between the measuring window and the substrate surface by feedback control to eliminate the bubble characteristic variations. The thickness of the film applied to the substrate surface and undergoing the grinding process is determined, with the spacing between the measuring window and the substrate surface adjusted to eliminate the bubble characteristic variations.


Find Patent Forward Citations

Fujiwara, Nariaki. (1999). Grinding process monitoring system and grinding process monitoring method (U.S. Patent No. 6000996). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6000996

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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