The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1999
Filed:
Mar. 12, 1998
Anilkumar Chinuprasad Bhatt, Johnson City, NY (US);
Donald Herman Glatzel, New Milford, PA (US);
Allen F Moring, Vestal, NY (US);
Voya Rista Markovich, Endwell, NY (US);
Kostas Papathomas, Endicott, NY (US);
David John Russell, Apalachin, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil to the substrate, and forming holes in the substrate through the foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited into the holes and is heated to at least partially cure it. The surface of the filler material is seeded and electrolessly plated to form a conductive coating on the metal foil and the filler material. The coating is then patterned to form a wiring layer. A second set of holes may be formed in the circuitized substrate after the hole filling step, which are also electrolessly plated.