The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Apr. 25, 1997
Applicant:
Inventors:

Tsutomu Saito, Tokyo, JP;

Masatoshi Araki, Tokyo, JP;

Shigemi Sunamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29830 ; 29720 ; 29721 ; 29833 ; 29834 ; 156 64 ;
Abstract

A method and apparatus for manufacturing a multilayer printed circuit board wherein printed circuit boards are laminated by accurate in positional alignment. A first supporting means for supporting a first printed circuit board is provided on a lower table 11 and second supporting means for supporting a second printed circuit board P2 is provided thereover. One end of the lower table is supported by a first movement means equipped with an XY table mechanism and another end thereof is supported by a Y table mechanism and second movement means for enabling an X-directional free sliding movement. The positions of respective marks m and n on the printed circuit boards are imaged by imaging means. The printed circuit boards are relatively moved by the movement means and the positional error thereof is corrected based on image processing. The first and second printed circuit boards are then secured together.


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