The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1999

Filed:

Feb. 03, 1998
Applicant:
Inventors:

Hiroaki Iwaki, Tokyo, JP;

Kouichi Kumagai, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257903 ; 257347 ; 257369 ;
Abstract

In a CMOS SRAM cell formed on an SOI substrate and including a flip-flop having first and second NMOS and PMOS transistors, transfer gates having first and seconf MOS transistors, and a word line section, characterized in that:the word line section extends along a predetermined direction; that source and drain diffusion layer regions of the first and second NMOS and PMOS transistors are arranged along the predetermined direction, and gates of these NMOS and PMOS transistors are arranged on channel regions thereof in a direction perpendicular to the predetermined direction; that the gates of the first and second NMOS transistors are electrically connected to the gates of the first and second PMOS transistors, respectively; and that in regions between the gates of the first and second NMOS transistors on the channel regions and the gates of the first and second PMOS transistors on the channel regions, each of the drain diffusion layer regions of the fisrt and second NMOS and PMOS transistors, and each one of the drain and source diffusion layer regions of the first and second MOS transistors are respectively arranged to be adgacent to each other and are electrically connected to each other, respectively, through a diffusion layer interconnection.


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