The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1999
Filed:
Sep. 10, 1997
Applicant:
Inventors:
Yoshiyuki Nakaki, Tokyo, JP;
Tomohiro Ishikawa, Tokyo, JP;
Masashi Ueno, Tokyo, JP;
Hisatoshi Hata, Tokyo, JP;
Masafumi Kimata, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257254 ; 257517 ; 257518 ; 257520 ; 7351416 ; 7351421 ; 7351422 ; 7351433 ; 7351434 ; 73DI / ; 73DI / ; 438 50 ; 438 52 ;
Abstract
A sensor element provided with a silicon substrate having a semiconductor circuit, a sensing-element portion formed on the silicon substrate and connected to the semiconductor circuit, and a cavity portion formed by removing a silicon substrate portion below the sensing-element portion, in which a removal resistance region having resistance against substrate removal is provided in the silicon substrate between the semiconductor circuit and the cavity portion.