The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1999

Filed:

Oct. 06, 1997
Applicant:
Inventor:

Carl R Smith, Crystal Lake, IL (US);

Assignee:

Northrop Grumman Corporation, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174 5052 ; 174 5061 ; 174 523 ; 1741 / ;
Abstract

An electronic package includes a graphite-aluminum metal matrix composite (MMC) housing or support member that dissipates heat from an electronic component or circuit and a hermetic glass feedthrough seal between the graphite-aluminum MMC material and one or more electrical feedthrough pins or wires connected to the electronic component. The glass feedthrough seal comprises a low melting point, low coefficient of expansion (CTE) solder glass, such as lead zinc borosilicate, effective to form a hermetic glass-to-composite seal by a combined chemical and mechanical compression sealing force. The vitreous solder glass preferably exhibits a CTE in the range of about 41 to about 78 ppm/degree C. and a melting temperature in the range of about 300 to about 500 degrees C.


Find Patent Forward Citations

Smith, Carl. (1999). Graphite aluminum metal matrix composite microelectronic package (U.S. Patent No. 5998733). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5998733

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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