The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1999
Filed:
Nov. 09, 1998
Applicant:
Inventors:
Shinichiro Hatta, Hirakata, JP;
Hidetaka Higashino, Matsubara, JP;
Kumiko Hirochi, Moriguchi, JP;
Hideaki Adachi, Neyagawa, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
505236 ; 505237 ; 505239 ; 505701 ; 505704 ; 428336 ; 428469 ; 428701 ; 428702 ; 428930 ;
Abstract
Excellent films of a high Tc superconductor are easily produced on metal coated substrates at a temperature below 700.degree. C. These metal buffer films are made of Pt, Au, Ag, Pd, Ni or Ti. The film superconductivity is significantly improved by the metal buffer layer. Since it is easy to form this metal coating on a substrate, the invention can increase the potential number of usable substrates such as fibers, amorphous solids or semiconductors.