The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1999
Filed:
Jul. 14, 1998
Centro Sviluppo Materiali S.p.A., Rome, IT;
Abstract
A process for the deposition of thick coatings with a thickness >1 mm on products made of copper or alloys thereof, wherein said products are subjected to the following operations: surface activation of the product made of copper or alloys thereof; optional heat stabilization to a temperature below the ones causing deterioration of the chemical and physical properties of the copper or alloys thereof; deposition of a first layer, for example of Ni or alloys thereof; optional interdiffusion heat treatment; optional activation of the surface of the first layer; thermal stabilization of said product at a temperature of between 20.degree. and 400.degree. C.; deposition of one or more intermediate layers of at least one of the following: Al; AlSi; Cu; Ni; NiAl; NiCr; NiCu; MCrAlY (wherein M can be Ni, Co, Fe or mixtures thereof), mixtures thereof, or mixtures of said intermediate layers with said thick coating; thermal stabilization of the product coated with said intermediate layers at a temperature of between 20.degree. and 300.degree. C.; and deposition of said thick coating on the product coated with said intermediate layers.