The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1999
Filed:
Oct. 13, 1997
Applicant:
Inventors:
Rensei Futatsuka, Aizuwakamatsu, JP;
Junichi Kumagai, Aizuwakamatsu, JP;
Shunichi Chiba, Aizuwakamatsu, JP;
Assignee:
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420472 ; 420482 ; 420490 ; 420499 ;
Abstract
A high-strength Cu based alloy, consists of:
Futatsuka, Rensei. (1999). High-strength copper based alloy free from smutting during pretreatment (U.S. Patent No. 5997810). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5997810
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile