The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1999

Filed:

Jun. 24, 1997
Applicant:
Inventor:

John Michael Heuchert, Macomb, MI (US);

Assignee:

JAC Products, Inc., Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264500 ; 2643281 ; 425546 ; 425555 ;
Abstract

An injection mold system and corresponding method that equalizes pressure of flowable plastic dispensed into an injection mold cavity. A gate in communication with the mold cavity introduces a quantity of flowable plastic into the cavity at a predetermined pressure. A gas inlet in communication with the mold cavity at a mold cavity location remote from the gate introduces a gas into the mold cavity to pack the flowable plastic in the mold cavity at a pressure corresponding generally to the predetermined pressure, to thereby minimize the formation of sink marks and warpage on an injection molded part formed therein. The present invention insures formation of the part with a highly finished appearance surface and eliminates the need for painting or otherwise additional finishing of the part.


Find Patent Forward Citations

Heuchert, John. (1999). Injection mold internal pressure equalization system and method (U.S. Patent No. 5997797). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5997797

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…