The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1999

Filed:

May. 29, 1998
Applicant:
Inventors:

Stephen C Danforth, Belle Mead, NJ (US);

Ahmad Safari, Princeton Junction, NJ (US);

John Ballato, Central, SC (US);

Remco Van Weeren, Oldwick, NJ (US);

Amit Bandyopadhyay, Edison, NJ (US);

Assignee:

Rutgers, The State University, New Brunswick, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; C04B / ;
U.S. Cl.
CPC ...
264401 ; 264219 ; 264308 ; 264317 ; 264603 ; 347-1 ; 419-1 ; 419 36 ;
Abstract

Solid freeform fabrication techniques are used in direct methods to form photonic bandgap structures, and in indirect methods to form molds for photonic bandgap structures. In the direct methods, solid particulate materials are mixed with a binder and, through a computer-controlled process, are built layer by layer to form the structure. In the indirect methods, unfilled polymeric materials are built layer by layer to form a negative mold for the photonic bandgap structure. The cavities within the mold may then be filled with a slurry incorporating solid particulate materials. Subsequent processing may include mold removal, binder removal, densification and secondary infiltration steps to form a photonic bandgap structure having the desired properties.


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