The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1999
Filed:
Oct. 09, 1997
Masato Maeda, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A lead cutting apparatus of an electronic component, which is capable of cutting of leads of the component to a specific length independent of the shape and size of the component. This apparatus includes a table with a flat surface on which an electronic component is placed. The package of the component is supported by the flat surface of the table. A pair of cutting units are located at each side of the table. Each of the pair of cutting units has a gripper for gripping a corresponding one of the leads of the component, a cutter for cutting the corresponding one of the leads to a specific length, and a retainer for retaining the package of the component on the table. The pair of cutting units are designed to be moved toward the table and away from the table by a pair of moving units, respectively. The pair or cutting units are moved toward the table until the retainers are contacted with the package of the component by the pair of driving units, respectively, thereby positioning the component on the flat surface of the table. The grippers of the pair of cutting units are moved to grip the corresponding leads. The cutters of the pair of cutting units are moved to cut the gripped leads to the specific length.