The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
May. 19, 1997
U.S. Philips Corporation, New York, NY (US);
Abstract
An electronic component has a substrate, electrode layers for the bottom electrode, top electrode and, optionally, one or more intermediate electrodes, and has intermediate functional layers, these electrode layers include an electroconductive oxidic compound, at least one electrode layer is composed of EuO.sub.x, wherein 1.ltoreq.x.ltoreq.2, LiTi.sub.2 O.sub.4, LiV.sub.2 O.sub.4, SrVO.sub.3, Eu.sub.x NbO.sub.3, Na.sub.x WO.sub.3, A.sub.2 P.sub.8 W.sub.32 O.sub.112, wherein A=K, Rb,RTl, Na.sub.x Ta.sub.y W.sub.1-y O.sub.3, Na.sub.1-x Sr.sub.x NbO.sub.3, LaTiO.sub.3 CeTiO.sub.3, CaVO.sub.3, La.sub.1-x Sr.sub.x VO.sub.3, SrCoO.sub.3, CaRuO.sub.3, SrRuO.sub.3, BaRuO.sub.3, BaPbO.sub.3, SrMoO.sub.3, Sr.sub.0.5 La.sub.0.5 O.sub.3, La.sub.4 BaCu.sub.5 O.sub.13-x, La.sub.2-x Sr.sub.x CuO.sub.4-.delta., YBa.sub.2 Cu.sub.3 O.sub.7-.delta., Bi.sub.2 Sr.sub.2 CaCu.sub.2 O.sub.8.sub.+d, Bi.sub.2 Sr.sub.2 CuO.sub.6+d, Bi.sub.2 Sr.sub.2 Ca.sub.2 Cu.sub.3 O.sub.10+d, Tl.sub.2 Ba.sub.2 CaCu.sub.2 O.sub.8, TlBa.sub.2 CuO.sub.6+d, Tl.sub.2 Ba.sub.2 Ca.sub.2 Cu.sub.3 O.sub.10+d, La.sub.4 BaCu.sub.6 O.sub.15, Gd.sub.1-x Sr.sub.x VO.sub.3, CaCrO.sub.3, SrFeO.sub.3, EuNbO.sub.3, SrIrO.sub.3, CaMoO.sub.3, BaMoO.sub.3, Bi.sub.3 Ru.sub.3 O.sub.11, VO.sub.2, CrO.sub.2, MoO.sub.2, WO.sub.2, PtO.sub.2, RuO.sub.x, wherein 1.5.ltoreq.x.ltoreq.2, IrO.sub.x, SnO.sub.2-x, La.sub.3 Ni.sub.2 O.sub.7, La.sub.3 Ni.sub.3 O.sub.10, M.sub.2 V.sub.2 O.sub.7-x, wherein M=Tm, Lu, M.sub.2 Mo.sub.2 O.sub.7, wherein M=Nd,Sm,Gd, Lu.sub.2 Ru.sub.2 O.sub.7, Pb.sub.2 Ru.sub.2 O.sub.7, Bi.sub.2 Ru.sub.2 O.sub.7, Pb.sub.2 Os.sub.2 O.sub.7, Tl.sub.2 Os.sub.2 O.sub.7, Pb.sub.2 Ir.sub.2 O.sub.2, Tl.sub.2 Rh.sub.2 O.sub.7-x, K.sub.0.3 MoO.sub.3, Rb.sub.0.3 MoO.sub.3, Tl.sub.0.3 MoO.sub.3 M.sub.x V.sub.2 O.sub.5, wherein M=Cu,Na, Mo,.sub.17 O.sub.47 or Tl.sub.2 O.sub.3-x, or of physical mixtures and/or solid solutions of the oxidic compound or physical mixtures and/or solid solutions of the oxidic compounds to which is a 50% by weight of further compounds or metals is added. This electrode layer exhibits an improved adhesion and it does not passivate itself.