The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 1999

Filed:

Feb. 18, 1999
Applicant:
Inventor:

Yasuyoshi Suzuki, Fujisawa, JP;

Assignee:

Komatsu, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N / ; H04N / ; G06K / ;
U.S. Cl.
CPC ...
3562375 ; 356394 ; 348126 ; 382145 ; 382146 ;
Abstract

A semiconductor package inspection apparatus comprises single photographic device disposed above the semiconductor package, and comprises light splitter for splitting light in different directions according to three different wavelength ranges in the light; and three image pickup units for separately photographing light of the three wavelength ranges which has been split by the light splitter; lighting device comprising first lighting for inspecting leads of the semiconductor package; second lighting for inspecting marks printed on top face of the semiconductor package; and third lighting for inspecting defects of the semiconductor package, the first, second and third lightings being disposed at locations different from each other, and having wavelength ranges into which the light has been split by the light splitter, and inspection device for simultaneously operating the first, second and third lightings of the lighting device and the three image pickup units of the photographic device to inspect leads of the semiconductor package, marks printed on top face of the semiconductor package and defects in the semiconductor package based on the photographic data from the three image pickup units.


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