The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
May. 06, 1999
Noriaki Higuchi, Chiyoda-ku, JP;
Koji Futatsumori, Shah Alam, MY;
Chiat Hooi Keow, Shah Alam, MY;
Hui Teng Teoh, Shah Alam, MY;
Toshio Shiobara, Usui-gun, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
In an epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70% by weight of an inorganic filler, at least one of the epoxy resin and the curing agent has such a molecular weight distribution as to provide an average dispersity Mw/Mn of less than 1.6, a two-nucleus compound content of less than 8% by weight and a seven- and more-nucleus compound content of less than 32% by weight. When the composition is cured at 180.degree. C. for 90 seconds into a primary product having Tg1 and the primary product postcured at 180.degree. C. for 5 hours into a secondary product having Tg2, the relationship: (Tg2-Tg1)/Tg2<0.1 is satisfied. The composition is fast-curing and effectively moldable and cures into a reliable product without a need for postcure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile