The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
May. 21, 1997
Applicant:
Inventors:
Assignee:
Zowie Technology Corporation, Taipei Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H05K / ;
U.S. Cl.
CPC ...
438109 ; 361807 ;
Abstract
The subject invention relates to a method of production of fiberglass reinforced resin plate type semi-conductor diodes, by which the lead wiring of semi-conductor diode is directly included in the production of fiberglass reinforced resin (FRP) foundation plate, to supersede conventional lead frame, to enable the designing of any styles to suit actual needs, and with the design of connecting holes, several layers of different circuits can be connected to comprise 3-dimensional multi-layer circuits.
Quick Actions:
Tai, George. (1999). Method of making a fiberglass reinforced resin plate (U.S. Patent No. 5994167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5994167
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile