The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
Sep. 09, 1997
Applicant:
Inventors:
Yuji Tanaka, Kanagawa, JP;
Masahito Kuramitsu, Kanagawa, JP;
Nobuyoshi Umeniwa, Kanagawa, JP;
Yoshimasa Matsuura, Kanagawa, JP;
Assignee:
Asahi Kasei Kogyo Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264500 ;
Abstract
An injection compression molding method is characterized in that a resin is injected from a resin gate provided near a recess portion of a mold corresponding to a thick rib portion, gas is injected from the thick rib portion before the mold is closed and compressed, and thereafter the resin is made to flow back from the resin gate to an injection nozzle while the mold is closed and compressed.
Tanaka, Yuji. (1999). Injection compression molding method (U.S. Patent No. 5993723). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5993723
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile