The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
Jul. 09, 1998
Koji Hattori, Hiroshima-ken, JP;
Yasuyuki Baba, Hiroshima-ken, JP;
Yasunari Suzuki, Hiroshima-ken, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
A method and system for determining the bonding quality of a bonded area of a flapped boxmaking blank in a boxmaking apparatus at an assembling station of a production line, where opposite end portions of the blank are bonded together with confronting edges of companion end flaps defining a required gap, in terms of the outline of the gap. The quality determination is accomplished by irradiating sheetlike light onto the bonded area across the gap, forming an image of the irradiated light as a light image line composed of discrete segments which are arranged along a reference line for the flap portions and include at least one line segment located off the reference line, computing a ratio of a length of the off-line segment to the entire length of the light image line to obtain a width of the gap, and comparing the width of the gap with a preset reference value.