The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
Dec. 23, 1998
Elmar Mock, Biel, CH;
Yasuyuki Moriyama, Funabashi, JP;
Tetra Laval Holdings & Finance S.A., Pully, CH;
Abstract
A parts supplying apparatus for supplying an array of resin molded part (10) includes an elongated guide member (80) having a longitudinally extending guide passage (81) through which the parts array is fed, and a rotatably driven winding device (43). The guide member has a guide surface (83) along which the parts array is guided and is also provided with at least one hole (85) through which the carrier (31, 33) is drawn to allow the carrier to be drawn away and separated from the molded parts. The carrier is adapted to be wound on the winding device for pulling the carrier and effecting movement of the parts array within the guide passage and for causing the carrier to be separated from the molded parts as the molded parts move past the hole in the guide member. A parts array utilized in conjunction with such an apparatus includes a plurality of molded parts and a carrier to which each of the molded parts are arranged in a row on the carrier. The molded parts are attached to the carrier in such a way that the molded parts are separable from the carrier when the carrier is pulled away from the molded parts. The carrier can be in the form of a pair of wires (31, 33) or a tape (131).