The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1999
Filed:
Nov. 08, 1996
Applicant:
Inventor:
Jin Sung Kim, Cheongju, KR;
Assignee:
LG Semicon Co., Ltd., Cheongju, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257778 ; 257687 ; 257698 ; 257780 ; 257783 ; 257746 ;
Abstract
A ball grid array (BGA) semiconductor package includes a package case having a recess in an upper surface thereof, a semiconductor chip received in the recess, and a connection means provided on an active region of the chip. A molding compound molds the chip and fills a gap between the package case and the connection member. The package enables a thinner package fabrication and reduces an access time of a package device, thereby realizing a high speed device.
Kim, Jin. (1999). Semiconductor package having a connection member (U.S. Patent No. 5990563). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5990563
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile