The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1999
Filed:
May. 30, 1997
Michiaki Hiyoshi, Yokohama, JP;
Kazunobu Nishitani, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A multichip press-contact type semiconductor device including a plurality of semiconductor chips, a plurality of heat buffer plates, a conductive metal sheet, and first and second press-contact electrode plates. The heat buffer plates are disposed to correspond to the plurality of semiconductor chips. The conductive metal sheet is located on the plurality of heat buffer plates and substantially decreases the parasitic inductance by causing a short-circuit in electrode wiring connecting the semiconductor chips. The first press-contact electrode plate is located on the conductive metal sheet, and has column protrusions corresponding to the semiconductor chips on the surface facing the semiconductor chips. The second press-contact electrode plate is located on the side of the rear surface of the semiconductor chips. The first and second press-contact electrode plates hold therebetween the conductive metal sheet, the heat buffer plates, and the semiconductor chips, piled on each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile