The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Oct. 28, 1998
Applicant:
Inventors:
Grant M Smith, Bryn Athyn, PA (US);
Vladimir K Tamarkin, Huntingdon Valley, PA (US);
Assignee:
Unisys Corporation, Blue Bell, PA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 361690 ; 361707 ; 361709 ; 361713 ; 361719 ; 361721 ; 165 802 ; 165 803 ; 165185 ; 174 163 ; 174 161 ;
Abstract
An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.
Quick Actions:
Smith, Grant. (1999). Stacked circuit board assembly adapted for heat dissipation (U.S. Patent No. 5986887). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5986887
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile